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 Metal Powder
MLCC Internal Paste
MLCC External Paste
Conductive Paste
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MC-Pt100 Platinum Electrode Paste
Low Temperature Setting Silver Paste
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Metal Powder
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1、Superfine Silver
Powder （YJ-F-Ag） |
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This powder can be used in microelectronic thick film as conducting material. You can make low temperature silver paste by it when matched with suitable resin. |
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Main Performance Index |
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| Item |
F-Ag-01 |
F-Ag-02 |
F-Ag-02 |
| Purity |
≥99.9% |
≥99.9% |
≥99.95% |
| Average Grain Size,
um |
≤0.5um |
≤0.1um |
≥1.0 |
| Specific
Surface Area, m²/g |
≥1.3 |
≥1.9 |
≥1.1 |
| Loose
Density, g/cm³ |
1.12~1.5 |
0.9~1.5 |
≤1.0 |
| Tap Density,
g/cm³ |
1.5~2.0 |
1.2~1.8 |
1.0~1.5 |
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2、Bright Flake Silver
（YJ-F-AgL） |
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It is mainly used as conductive coating in electronic industry. And it can be mixed with resin binder to make many kinds of low temperature silver paste for transistors' cementation. |
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Main Performance Index |
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| Index |
F-AgL-01 |
F-AgL-02 |
| Specific Surface Area,
m²/g |
0.5~1.0 |
1.0~2.5 |
| Loose Density
, g/cm³ |
1.0~1.3 |
1.5~2.5 |
| Tap Density
, g/cm³ |
2.5~3.0 |
3.0~4.0 |
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3、Superfine Platinum Powder（YJ-FPt-01） |
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It is mainly used as conductive component in thick-film paste in electronic industry. It is the conductive component of high stability, high reliability, high performance conductive paste and electrode paste. |
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Main Performance Index |
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| Index |
F-Pt-01 |
| Purity,% |
Pt >99.9% |
| Average Grain Size ,um |
0.1~0.5 |
| Specific Surface Area,
m²/g |
0.5~5.0 |
| Loose Density,
g/cm³ |
1.1~1.5 |
| Tap Density,
g/cm³ |
1.5~2.5 |
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4、Superfine
Palladium Powder （YJ-FPd） |
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It is mainly used as thick-film paste and MLCC internal/external material in electronic industry. |
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Main Performance Index |
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| Index |
F-Pd-01 |
| Purity,% |
Pd
>99.9% |
| Average Grain Size, um |
0.5 |
| Specific Surface Area
,g/cm³ |
>1.0 |
| Loose Density
, g/cm³ |
0.5~1.0 |
| Tap Density,
g/cm³ |
0.9~1.3 |
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5、Superfine Alloy Powder of Silver and Palladium (YJ-AgPd) |
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It is mainly used as the conductive phase in MLCC electrode paste. The ratio of silver and palladium are 9:1, 7:3, 3:7, etc. We can produce any alloy powder of different ratio according to requirement. |
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Main Performance Index |
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| Brand |
F-AgPd |
| Purity,% |
Ag+Pd >99.9% |
| Average Grain Size, um |
0.3 |
| Specific Surface Area
, g/cm³ |
1.0~4.0 |
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Loose Density
, g/cm³ |
0.6~0.9 |
| Tap Density,
g/cm³ |
1.0~1.81 |
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MLCC Internal Paste |
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1、M-IP9000 Silver/Palladium Internal Paste |
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It is mainly used as MLCC internal paste. It has good flowing power and thixotropy which assure distinct printing shape. We can adjust the viscosity and drying speed according to users' production flow. The performances of Ag90/Pd10, Ag70/Pd30 and Ag85/Pd15 reach the level of international like products.
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Main Performance Index |
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| Index |
M-IP9030 |
M-IP9015 |
M-IP9010 |
| Metal
Content，% |
52~60 |
52~60 |
52~60 |
| Silver/Palladium |
70/30 |
85/15 |
90/10 |
| Fineness of Paste.
um |
≤5 |
≤5 |
≤5 |
| Drying Condition |
40~60℃，2~2.5min |
40~60℃，2~2.5min |
40~60℃,2~2.5min |
| Sintering
Temperature，℃ |
1140 |
1040 |
960 |
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2、M-IP8000 Pure Palladium Electrode Paste |
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Main Performance Index |
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| Brand |
M-IP8000 |
| Metal Content，% |
52~60 |
| Fineness of Paste
. um |
< 4 |
| Drying Condition |
40~60℃，2~2.5min |
| Sintering Temperature，℃ |
1550 |
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3、Ag100-66 Pure Silver Internal Paste |
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It is mainly used as internal electrode of MLCC and is well matched with barium titanate ceramics. |
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Main Performance Index |
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| Brand |
Ag100-66 |
| Metal Content，% |
62±1 |
| Fineness of Paste
. um |
< 8 |
| Drying Condition |
40~60℃，3~5min |
| Sintering Temperature，℃ |
890 |
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MLCC External Paste |
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1、Ts Solderable External Paste |
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It is mainly used as external electrode of MLCC. This paste has good rheologic performance and can be used in continuous production by mechanical coating. The surface of the paste will not flow when been coated. And the surface is smooth and indehiscent. The Adhesive, solderability and solder leach resistance is qualified. The viscosity can be adjusted according to user' requirement.
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Main Performance Index |
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| Brand |
Ts-8020 |
Ts100-72 |
| Metal
Content，% |
72±1 |
72±1 |
| Silver/Palladium |
80/20 |
100/0 |
| Fineness of Paste
，um |
≤10 |
≤10 |
| Drying Condition |
180~260℃，8~10min |
180~260℃，8~10min |
| Sintering Temperature，℃ |
750-860 |
760-850 |
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2、Plateable External Paste |
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It is mainly used as the external electrode of MLCC and is suitable to be used as the base conductor. This paste has good conductibility, platability, acid and alkaline resistance and rheological performance, and can be used in continuous production by mechanical coating. The surface of the paste will not flow when been coated. And the surface is smooth and indehiscent. |
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Main Performance Index |
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| Brand |
TP100-74 |
| Metal Content，% |
74±1 |
| Fineness of Paste
，um |
≤8 |
| Drying Condition |
180~260℃，8~10min |
| Sintering Temperature，℃ |
820~850 |
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Conductive Paste |
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1、HC Silver/Palladium Conductive Paste |
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It is mainly used as the conduct-band in thick-film integrated circuit, the inner link of thick-film composite circuit, the link of different elements and the conductor of resistor's terminal.
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Main Performance Index |
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| Brand |
HC-20 |
HC8-75 |
HC2-75 |
| Metal Content，% |
75±1 |
75±1 |
75±1 |
| Silver/Palladium |
80/20 |
92/8 |
98/2 |
| Fineness of
Paste, um |
≤8 |
≤8 |
≤8 |
| Viscosity,
Pa.s |
130~150 |
120~150 |
120~150 |
| Sintering
Temperature,℃ |
850 |
850 |
850 |
| Thickness of Sintered
Menbrane, um |
15~20 |
12~16 |
10~14 |
| Sheet Resistivity，mω/□ |
15~20 |
8~12 |
4~8 |
| Solderability |
good |
good |
good |
| Solder Leach Resistance |
>5times |
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| Stripping
Adhesion, N/2×2mm2 |
>40（initial） |
>40（initial） |
>40（initial） |
| >20（ageing） |
>20（ageing） |
>20（ageing） |
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2、HD100 Silver Conduct Paste |
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It is suitable for the conductor of terminal of high pass filter and other electronic component. |
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Main Performance Index |
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| Brand |
HD100 |
| Metal Content，% |
75 |
| Fineness of Paste，
um |
≤10 |
| Sintering Temperature，℃ |
850 |
| Sheet Resistivity，
mΩ/□ |
3~6 |
| Vertical
Adhesion, N/2×2mm2 |
> 60 |
| Solderability |
good |
| Solder Leach Resistance |
good |
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3、HI2002 Medium Temperature Conductive Paste |
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It is suitable to be printed with 200~325 mesh screen-printing and mainly used as conductor sintered under low temperature. |
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Main Performance Index |
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| Brand |
HD2002 |
| Metal Content，% |
75~80 |
| Fineness of Paste，
um |
≤10 |
| Sintering Temperature，℃ |
550~650 |
| Sheet Resistivity，
mΩ/□ |
1~2 |
| Solderability |
good |
| Vertical
Adhesion, N/2×2mm2 |
> 60 |
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4、H-Pt02 Silver/Platinum Conductor Paste |
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It is suitable for Al2O3 ceramic substrate and is used as the conductor of thick-film integrated circuit and glassglaze potentiator's terminal. |
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Main Performance Index |
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| Brand |
H-Pt02 |
| Viscosity，
Pa.s |
120~150 |
| Fineness of Paste，um |
≤10 |
| Sintering Temperature，℃ |
850 |
| Sheet Resistivity，
mΩ/□ |
2~5 |
| Thickness of Sintered Menbrane，
um |
12~18 |
| Solderability |
good |
| Vertical
Adhesion, N/2×2mm2 |
> 40（initial） |
| >20（ageing） |
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MC-Pt100 Platinum Electrode Paste |
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It is suitable for the electrode material of sensor. Sinter temperature is 850℃. Holding temperature 10 minutes and furnace cooling. This paste must be stirred before use. Generally, you needn't to dilute the paste, but you can drip some terpilenol to prevent the heavy reduction of viscosity. |
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Low Temperature Setting Silver Paste |
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It is suitable for the electrode of thin film switch and printed circuit. It can be coated or printed on the elements.
It has good conductibility and adhesion when solidified. |
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Main Performance Index |
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| Brand |
DG-150 |
DG-100 |
| Solidification
Temperature,℃ |
150 |
100 |
| Solidification
Time, min |
30 |
30 |
| Sheet Resistivity,
mΩ/□ |
<60 |
<60 |
| Adhesion |
good |
good |
| Storage Condition |
< 10℃ |
< 10℃ |
| Storage Time |
Half a Year |
Half a Year |
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