Sputtering is a type of physical vapor deposition (PVD) that is used to deposit thin films onto various surfaces (e.g. silicon wafer) by physical means, as compared to chemical vapor deposition (CVD). In PVD, the target source is bombarded with argon ions, which knock off atoms from the target that coat a receiving wafer creating a uniform metal film on the wafer, Sputtering is one of the most widely used techniques for deposition various metallic films on wafers, including aluminum, aluminum alloys, platinum, gold titanium-tungsten, tungsten, tantalum, and copper. |
